Next-generation Communication / Battery
TUFTEC™ and S.O.E.™ are superior in terms of flexibility and dielectric property and used as modifier for thermosetting and thermoplastic resins which are used for substrate, or used for adhesive layer of multi-layer substrate.
Double bond of TUFTEC™ P series enables it to cross-link with other materials.
Recommended Grades
H1043
P1500
P2000
S1605
M1913
MP10
Characteristics
- Low dielectric constant, low dielectric loss tangent
- Excellent voltage characteristics
- Adhesive with circuit board material
- Solvent solubility
- Cross-linkable in process
- Adding flexibility
- Excellent compatibility with blended resins
(PI, LCP, PPE, BMI, epoxy resin, etc.)
Applications
- Electrode binder
- Circuit board, film(CCL, FCCL)
- Bonding sheet, film
- Interlaminar Insulator
- Antenna cover
- Optical clear adhesive
